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عنوان البحث(Papers / Research Title)


NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I


الناشر \ المحرر \ الكاتب (Author / Editor / Publisher)

 
واثق ناصر حسين الشمري

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واثق,ناصر,حسين,الشمري ,NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I , Time 04/01/2018 08:32:32 : كلية الهندسة/المسيب

وصف الابستركت (Abstract)


this article is about numerical solution of the deposition process inside a trench

الوصف الكامل (Full Abstract)

Abstract
Current distribution of copper electrodeposition in a trench (at different flow conditions) was studied taking into consideration the effect of hydrogen evolution. Due to pH effect on solubility of Cu+2 ions and the feasibility to precipitate as hydroxides at high pH, thus the importance of such study was handled. The results showed that the deposition in general was non uniform along the lateral walls, the non-uniformity not affected by current or flow velocity. Velocity not affect H+ concentration inside the trench and its value remained the same as that for the initial one meaning that Cu hydroxide precipitate was not possible.

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