عنوان البحث(Papers / Research Title)
Optimum Design of Rectangular Plate Heat Sink
الناشر \ المحرر \ الكاتب (Author / Editor / Publisher)
باسل مهدي هادي عباس
Citation Information
باسل,مهدي,هادي,عباس ,Optimum Design of Rectangular Plate Heat Sink , Time 7/2/2011 9:57:38 PM : كلية الهندسة
وصف الابستركت (Abstract)
Heat sinks, optimization, size and cost, thermal conductivity, temperature distribution, Heat Capacity.
الوصف الكامل (Full Abstract)
Optimum Design of Rectangular Plate Heat Sink:
The trends in electronics are toward decreasing size and cost, while increasing speed. Performance and reliability is resulted by increasing heat dissipated from the operating devices. As heat loads increase, the thermal management to keep junction temperatures within safe operating limits is becoming more critical.
The heat sink optimization study allowed for a determination of the heat sink geometry, which would produce a minimum thermal resistance, while producing the highest heat dissipation.
The objective of this paper is to present a method for designing the optimum thermal performance of heat sinks with uniform cross section of plate by using the Heat Capacity for the material. The model was used to explore the optimal dimensions of heat sink that cooling natural convection. It is found from the results that the best design of a (50 mm x 50 mm x 5 mm) aluminum heat sink with a temperature input of (50 oC) consists of (7) fins with (0.5 mm) fin thickness. Also, (ANSYS 5.4) finite element code is used to analyze the thermal behavior of a heat sink for a given of optimum dimensions.
Heat sinks are devices that enhance heat dissipation from a hot surface, usually the case of a heat generating component, to a cooler ambient, usually air. The air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the device operating temperature. The primary purpose of a heat sink is to maintain the device temperature below the maximum allowable temperature specified by the device manufacturers.
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