Abstract:-
Copper (Cu) and silicon (Si) powders strengthened epoxy resin was worked to research the action of powders respect to the mechanical properties such as (hardness and impact strength) , thermal and electrical conductivity for epoxy resin. Cu and Si powders were inserted to the matrix as filler with increasing in weight ratio (2%, 4%, 6% & 8%). This properties were estimated and compared. The results show that the hardness gradually increased with the increase of filler content until 4% from weight percentage of Si and after that decreased. The impact resistance for Si filled epoxy resin higher than Cu filled epoxy resin. The thermal and electrical conductivities increased with increasing of weight ratio for Cu and Si fillers content.
Keywords: Epoxy resin, Cu and Si powders, Mechanical properties, Physical properties.
INTRODUCTION :-
Composite materials are including of one or more interrupted phases embedded in a incessant phase. Interrupted phases are generally more difficult and sturdy than the incessant phases and these materials called the strengthening materials, while the incessant phase has less hard and more flexibility called "matrix" [1,2,3]. Reinforcements render to improvement the mechanical properties of matrix in the composite materials. The matrix and the strengthening phase are attached to each other by linkage surface is called interface [4].
The purpose of the composite material is to get the materials characterized by a low density, good toughness, high tensile strength and stiffness, high performance at high temperature and high wear resistance and thermal conductivity, good hardness and resistance to fatigue and corrosion, hence the properties of composite materials depends mainly on the characteristics of each matrix and reinforcing materials as well as the nature of the interface between them so they are used as heat sinks in electronic packaging applications [5,6,7].